1.安装不良其它，今天小编就来说说关于smt生产工艺流程图?下面更多详细答案一起来看看吧!
smt生产工艺流程图
1.安装不良
|
其它 |
Other |
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少件 |
Missing Component |
|
多件/残件 |
Extra Component on PCBA |
|
立碑 |
Tombstoning |
|
反向 |
Wrong Orientation |
|
错件 |
Wrong Component |
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偏位 |
Shift/Off Pad |
|
侧立 |
Side Termination |
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反白 |
Upsidedown |
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浮高 |
Float |
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脚长 |
Lead too long |
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翘脚 |
Lifted Lead |
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脚未出 |
Lead too short |
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未装Bumper |
missing Bumper |
|
螺丝松动 |
Loose Screw |
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未装螺丝 |
Missing Screw |
|
零件脚偏位 |
Part Pin Shift |
|
折脚 |
Bent Lead |
2. 焊 接 不 良
|
其它 |
Other |
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少锡 |
Insufficient Solder |
|
空焊 |
No Solder |
|
多锡/包焊 |
Excess Solder |
|
锡桥 |
Solder Bridge |
|
针洞/空洞 |
Pinholes/Void |
|
冷焊 |
Cold solder |
|
堵孔 |
Solder in PTH |
|
锡尖 |
Solder Projections |
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锡裂 |
Fractured Solder |
|
爬锡 |
Wicking |
|
拒锡 |
Dewetting |
3. 清 洁 度
|
其它 |
Other |
|
锡珠 |
Solder Balls |
|
锡渣 |
Solder Splashes |
|
助焊剂残留物 |
Flux Residues |
|
G/F 沾锡 |
Solder on G/F |
|
PCB 脏污 |
Contamination on PCB |
4. P C B
|
其它 |
Other |
|
断线 |
Trace open |
|
线路短路 |
Trace short |
|
分层 |
Delamination |
|
PAD 翘起 |
Lifted PAD |
|
板翘 |
Twist Board |
|
孔内沾绿油 |
Soldermask in PTH |
|
PAD 沾绿油 |
Soldermask on PAD |
|
Via 孔不通 |
Impedance On Via |
|
PAD 脱落 |
PAD Peeling |
|
PAD 氧化 |
PAD Discoloration |
|
线路有阻抗 |
Impedance On Trace |
|
裸铜 |
Bare Copper |
|
气泡 |
Blister |
|
Via 孔沾锡 |
Solder On Via |
|
白斑 |
Measling |
|
Via 孔沾绿油 |
Soldermask On Via |
|
丝印不良 |
Defect Silkscreen |
5. 元 件
|
其它 |
Other |
|
组件破损 |
Component Damaged |
|
组件功能不良 |
Component Fail |
|
高低 Pin |
Uneven Pin |
|
缺 Pin |
Missing Pin |
|
引脚变色 |
Lead Discoloration |
|
G/F 不良 |
G/F defect |
|
值偏大 |
Value High |
|
值偏小 |
Value Low |
|
歪 Pin |
Twisted Pin |
|
弯 Pin |
Bent Pin |
|
组件变形 |
Component Distortion |
不良现象中英文对照表
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1.缺件(MISSING PARTS) |
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2.错件(WRONG PARTS) |
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3.多件(EXCESSIVE PARTS) |
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4.短路(SHORT) |
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5.断路(OPEN) |
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6.线短(WIRE SHORT) |
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7.线长(WIRE LONG) |
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8.拐线(WIRE POOR DDRESS) |
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9.冷焊(COLD SOLDER) |
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10.包焊(EXCESS SOLDER) |
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11.空焊(MISSING SOLDER) |
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12.锡尖(SOLDER ICICLE) |
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13.锡渣(SOLDER SPLASH) |
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14.锡裂(SODER CRACK) |
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15.锡洞(PIN HOLE) |
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16.锡球(SOLDER BALL) |
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17.锡桥(SOLDER BRIDGE) |
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18.滑牙(SCREW LOOSE) |
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19.氧化(RUST) |
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20.异物(FOREIGNER MATERIAL) |
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21.溢胶(EXCESSIVE GLUE) |
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22.锡短路(SOLDER BRIDGE) |
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23.锡不足(SOLDER INSUFFICIENT) |
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24.极性反(WRONG POLARITY) |
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25.脚未入(PIN UNSEATED) |
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26.脚未出(PIN UNVISIBLE) |
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27.脚未剪(PIN NO CUT) |
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28.脚未弯(PIN NOT BENT) |
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29.缺盖章(MISSING STAMP) |
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30.缺标签(MISSING LABEL) |
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31.缺序号(MISSING S/N) |
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32.序号错(WRONG S/N) |
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33.标签错(WRONG LABEL) |
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34.标示错(WRONG MARK) |
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35.脚太短(PIN SHORT) |
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36.J1不洁(J1 DIRTY) |
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37.锡凹陷(SOLDER SCOOPED) |
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38.线序错(W/L OF WIRE) |
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39.未测试(NO TEST) |
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40.VR变形(VR DEFORMED) |
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41.PCB翘皮(PCB PEELING) |
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42.PCB弯曲(PCB TWIST) |
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43.零件沾胶(GLUE ON PARTS) |
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44.零件脚长(PARTS PIN LONG) |
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45.浮件(PARTS LIFT) |
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46.零件歪斜(PARTS TILT) |
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47.零件相触(PARTS TOUCH) |
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48.零件变形(PARTS DEFORMED) |
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49.零件损坏(PARTS DAMAGED) |
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50.零件脚脏(PIN DIRTY) |
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51.零件多装(PARTS EXCESS) |
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52.零件沾锡(SOLDER ON PARTS) |
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53.零件偏移(PARTS SHIFT) |
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54.包装错误(WRONG PACKING) |
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56.尺寸错误(DIMENSION WRONG) |
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57.二极管坏(DIODE NG) |
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58.晶体管坏(TRANSISTOR NG) |
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59.振荡器坏(X’TL NG) |
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60.管装错误(TUBES WRONG) |
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61.阻值错误(IMPEDANCE WRONG) |
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62.版本错误(REV WRONG) |
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63.电测不良(TEST FAILURE) |
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64.版本未标(NON REV LEBEL) |
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65.包装损坏(PACKING DAMAGED) |
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66.印章模糊(STAMPS DEFECTIVE) |
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67.标签歪斜(LABEL TILT) |
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68.外箱损坏(CARTON DAMAGED) |
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69.点胶不良(POOR GLUE) |
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70.IC座氧化(SOCKET RUST) |
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71.缺UL标签(MISSING UL LABEL) |
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72.线材不良(WIRE FAILURE) |
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73.零件脚损坏(PIN DAMAGED) |
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74.金手指沾锡(SOLDER ON GOLDEN FINGERS) |
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75.包装文件错(RACKING DOC WRONG) |
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76.包装数量错(PACKING Q’TY WRONG) |
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77.零件未定位(PARTS UNSEATED) |
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78.金手指沾胶(GLUE ON GOLDEN FINGERS) |
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79.垫片安装不良(WASHER UNSEATED) |
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80.线材安装不良(WIRE UNSEATED) |
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81. 立碑(TOMBSTONE) |
